Title
Understand the Physics of Solder Joint Degradation in Board Level Reliability Vibration and Thermal Cycle Test
Author
Zhang, Letian (TU Delft Electrical Engineering, Mathematics and Computer Science)
Contributor
Zhang, Kouchi (mentor) 
van Driel, W.D. (mentor)
Thukral, V. (mentor)
Inamdar, A.S. (mentor)
Shekhar, A. (graduation committee)
van Zeijl, H.W. (graduation committee)
Degree granting institution
Delft University of Technology
Corporate name
Delft University of Technology
Programme
Electrical Engineering
Date
2023-08-25
Abstract
Board-level reliability (BLR) looks at the reliability problem in the package and PCB interconnection, which is an important topic in microelectronics. The current criterion in the BLR test is to look if the connection is open, which can only detect the failure and there is no available method that can detect the degradation of the solder joints. This project mainly focuses on the degradation process of solder joints in board-level vibration tests and thermal cycle tests.
Special methods and test programs are developed tailored for two test vehicles, and some of the test results are collected and analyzed. Assisted by the failure analysis technique, the physical change of solder joints can be observed.
Findings in this study show the parameter shift during the solder joint degradation and also the mathematic model that describes the relationship between the crack of the solder joints and resistance increment.
Subject
Board level reliability
Microelectronic reliability
Solder joint
Degradation
Piezoresistive stress Sensor
To reference this document use:
http://resolver.tudelft.nl/uuid:143ee6e9-b641-461d-83e8-1e9a172e0404
Embargo date
2025-08-24
Part of collection
Student theses
Document type
master thesis
Rights
© 2023 Letian Zhang