Title
High Step Coverage Interconnects By Printed Nanoparticles
Author
van Ginkel, H.J. (TU Delft Electronic Components, Technology and Materials)
Romijn, J. (TU Delft Electronic Components, Technology and Materials) 
Vollebregt, S. (TU Delft Electronic Components, Technology and Materials)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Date
2021
Abstract
The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are therefore needed. Here, a method to direct-write metal tracks on the top and sides of dies is demonstrated. It is based on a spark ablation aerosol printing process entirely performed at room temperature and without any applied force. Therefore, it is suitable for use on soft or temperature-sensitive substrates. The printed metal lines consist of pure Au nanoparticles, without surfactants or contaminants, and do not require any further curing, cleaning, or other processing. The process is demonstrated on Si dies and paper, but is theoretically applicable on a wide variety of substrate materials. It can provide an alternative method to create interconnects or vias on soft materials, temperature sensitive materials, irregularly shaped materials, or curved surfaces.
Subject
Nanoparticles
flexible electronics
interconnect
thin-film
printing
spark ablation
To reference this document use:
http://resolver.tudelft.nl/uuid:17d87ff5-9092-4161-87ca-e56f2ee95ae1
DOI
https://doi.org/10.23919/EMPC53418.2021.9585005
Publisher
IEEE
Embargo date
2022-05-01
ISBN
978-1-6654-2368-7
Source
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Proceedings
Event
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021-09-13 → 2021-09-16, Online at Gothenburg, Sweden
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2021 H.J. van Ginkel, J. Romijn, S. Vollebregt, Kouchi Zhang