Print Email Facebook Twitter Overdriving reliability of chip scale packaged LEDs Title Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component Author Tang, H. (TU Delft Electronic Components, Technology and Materials; Changzhou Institute of Technology Research for Solid State Lighting) Ye, H. (Chongqing University) Wong, K.Y. (Changzhou Institute of Technology Research for Solid State Lighting) Leung, Stanley Y.Y. (Changzhou Institute of Technology Research for Solid State Lighting) Fan, Jiajie (Hohai University; Changzhou Institute of Technology Research for Solid State Lighting) Chen, Xianping (Chongqing University) Fan, Xuejun (Lamar University) Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) Date 2017 Abstract The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the impact of various components, including blue die, phosphor layer, and substrate, on the lumen depreciation of CSP LEDs after aging test. The electro-optical measurement results show that the overdriving current can lead to both massive light output degradation and significant color shift of CSP LEDs. The quantitative analysis results show that the phosphor layer is the major contributor to the failure in early period aging test. For the long-term reliability, the degradations of phosphor and reflectivity of substrate contribute significantly on lumen depreciation. The proposed reliability assessment method with overdriving loadings can be usefully implemented for LED manufacturers to make a cost- and effective-decision before mass production. Subject Chip scale packageComponent impactLight emitting diodesOverdriving reliability To reference this document use: http://resolver.tudelft.nl/uuid:1fd964eb-af3f-4635-a8d9-5b48cd523767 DOI https://doi.org/10.1016/j.microrel.2017.09.008 Embargo date 2019-09-14 ISSN 0026-2714 Source Microelectronics Reliability, 78, 197-204 Bibliographical note Accepted author manuscript Part of collection Institutional Repository Document type journal article Rights © 2017 H. Tang, H. Ye, K.Y. Wong, Stanley Y.Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Kouchi Zhang Files PDF 52554615_Microelectronics ... ponent.pdf 1000.43 KB Close viewer /islandora/object/uuid:1fd964eb-af3f-4635-a8d9-5b48cd523767/datastream/OBJ/view