Print Email Facebook Twitter Heat Transfer Enhancement in Passively Cooled 5G Base Station Antennas Using Thick Ground Planes Title Heat Transfer Enhancement in Passively Cooled 5G Base Station Antennas Using Thick Ground Planes Author Aslan, Y. (TU Delft Microwave Sensing, Signals & Systems) Puskely, J. (TU Delft Microwave Sensing, Signals & Systems) Roederer, A.G. (TU Delft Microwave Sensing, Signals & Systems) Yarovoy, Alexander (TU Delft Microwave Sensing, Signals & Systems) Date 2019 Abstract The thermal and electromagnetic effects of varying the ground plane thickness and aperture size of the 5G integrated base station antennas are investigated. A double-sided PCB structure is designed with antennas and digital beamforming chips on the opposite sides. Fully-passive cooling is achieved by using fanless CPU coolers attached to the chips. The simulation results indicate that as compared to the standard counterparts, much better cooling performance can be achieved using relatively thick ground planes with extended aperture sizes, with no significant effect on the electromagnetic properties. Subject active integrated antennabase station antennafifth generation (5G)millimeter-wave communicationpassive coolingthick ground plane To reference this document use: http://resolver.tudelft.nl/uuid:2781645f-699e-4225-b0e6-98e4ebb83aa9 Publisher IEEE ISBN 978-1-5386-8127-5 Source 2019 13th European Conference on Antennas and Propagation (EuCAP) Event EuCAP 2019, 2019-03-31 → 2019-04-05, Krakow, Poland Bibliographical note green Part of collection Institutional Repository Document type conference paper Rights © 2019 Y. Aslan, J. Puskely, A.G. Roederer, Alexander Yarovoy Files PDF 08740143.pdf 4.83 MB Close viewer /islandora/object/uuid:2781645f-699e-4225-b0e6-98e4ebb83aa9/datastream/OBJ/view