Print Email Facebook Twitter Pressure-assisted CU sintering for SiC Die-attachment application Title Pressure-assisted CU sintering for SiC Die-attachment application Author Liu, X. (TU Delft Electronic Components, Technology and Materials) Contributor Zhang, Kouchi (promotor) Ye, H. (copromotor) Degree granting institution MicroelectronicsDelft University of Technology Date 2023-01-30 Subject nano Cu sinteringSilicon carbide power electronics packagingShear StrengthMechanical reliabilityThermal conductivityMolecular dynamicsStatic and dynamic testNanoindentation To reference this document use: https://doi.org/10.4233/uuid:291baefe-c4b9-46ea-b250-a6c8f4e6ece8 ISBN 978-94-6473-018-0 Embargo date 2025-01-30 Part of collection Institutional Repository Document type doctoral thesis Rights © 2023 X. Liu Files file embargo until 2025-01-30