Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications
Wang, Xinyue (Fudan University)
Zeng, Zejun (Fudan University)
Zhang, Jing (Heraeus Materials Technology)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Liu, Pan (Fudan University)
O'Conner, L. (editor)
With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from high prices and electromigration. Therefore, a novel sintered material based on silver-copper core-shell structured particles raises the attention of researchers to solve this deficiency. To accelerate the development of new materials and their related processes, a four-sphere model of the silver-coated copper structure is established in this paper. The mathematical relationship between the porosity and thermal conductivity of sintered body and the actual sintering process was preliminarily established through the calculation based on a series of FEM simulations. The model was further validated through experiments. The modeling method and conclusion are utilized for future process adjustment, which is of great significance to accelerate the development, application, and reliability of new packaging materials.
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power electronic packaging
Proceedings of the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022-05-31 → 2022-06-03, San Diego, United States
Proceedings - Electronic Components and Technology Conference, 0569-5503, 2022-May
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
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© 2022 Xinyue Wang, Zejun Zeng, Jing Zhang, Kouchi Zhang, Pan Liu