Title
Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
Author
Qian, Cheng (Fudan University)
Hu, D. (TU Delft Electronic Components, Technology and Materials) 
Liu, Xu (Fudan University)
Fan, Xuejun (Lamar University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials; Fudan University)
Fan, J. (TU Delft Electronic Components, Technology and Materials; Fudan University; Research Institute of Fudan University, Ningbo)
Date
2023
Abstract
Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising nanosphere (NS) and nanoflake (NF), was carried out at temperatures ranging from 500K to 650K. Furthermore, shearing simulations were conducted with constant strain rates on the sintered structure at multiple temperatures, and subsequently correlated the extracted mechanical properties with the sintering behavior. The results indicated that the mechanical properties of nano-Cu sintered structure were improved by tuning material composition and increasing the sintering temperature. We established a relationship between the sintered microstructure and mechanical response, the shear modulus and shear strength of the sintered structure with NF particles increased to 41.2GPa and 3.51GPa respectively. It offers valuable insights into the preparation phase of nano Cu paste for sintering technology.
Subject
Nano Cu sintering
molecular dynamics simulation
Nanoflake
Shearing simulation
To reference this document use:
http://resolver.tudelft.nl/uuid:8f19f4d5-90f1-4fe7-847a-745bc35dfb28
DOI
https://doi.org/10.1109/EuroSimE56861.2023.10100810
Publisher
IEEE
Embargo date
2023-10-17
ISBN
979-8-3503-4598-8
Source
Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023-04-16 → 2023-04-19, Graz, Austria
Series
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 Cheng Qian, D. Hu, Xu Liu, Xuejun Fan, Kouchi Zhang, J. Fan