Multi-source unsupervised soft sensor based on joint distribution alignment and mapping structure preservation
Zhang, Z. (Taiyuan University of Technology; Beijing Institute of Technology)
Yan, Gaowei (Taiyuan University of Technology)
Qiao, Tiezhu (Taiyuan University of Technology)
Fang, Yaling (Taiyuan University of Technology)
Pang, Y. (TU Delft Transport Engineering and Logistics)
Aiming at the problem of mismatch between real-time data distribution and modeling data distribution caused by the change of working conditions in industrial process, which leads to the performance deterioration of the soft sensor model, a multi-source unsupervised soft sensor method based on joint distribution alignment and mapping structure preservation is proposed. Firstly, the method uses the hypergraph to establish the complex structure of feature and label, and clusters the hypergraph matrix in multiple views to completely construct the class pseudo label; then dynamic distribution alignment is used to adapt marginal distribution and conditional distribution between the data of historical working conditions and the current working conditions, and the hypergraph Laplacian operator is introduced for manifold regularization to prevent the mapping relationship between feature and label from being destroyed; finally, similar working conditions are introduced to further enhance the robustness of the model. The experimental results show that compared with the traditional unsupervised soft sensor methods, the method used in this paper can effectively improve the prediction accuracy of the model.
Dynamic distribution alignment
To reference this document use:
Journal of Process Control, 109, 44-59
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
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© 2022 Z. Zhang, Gaowei Yan, Tiezhu Qiao, Yaling Fang, Y. Pang