Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

Li, Xiao (Fudan University)
Tang, Jiuyang (Fudan University)
Zhao, Jiayan (Mazo Technology Company Limited)
Li, Jinbing (Mazo Technology Company Limited)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Liu, Pan (Fudan University)

2022

With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a method of using Soft Magnetic Powder filled Epoxy (SMPE) adhesive as a molding material to encapsulate a power module, which is a DC/DC buck converter power module contains several passive components, 1 power inductor, and a high-efficiency switching regulator with two integrated N-channel MOSFETs. On the basis of Finite Element Method (FEM), models were firstly established with component level moldings and checked with actual module samples for calibration. Based on the calibrated model, inductors without component level molding were then simulated. SMPE with 4~7μm insulated carbonyl ferrous powder were prepared and measured the magnetic relative permeability. Such material was investigated to pot the whole power module as a one-step molding, instead of separate molding for the power inductor and the power module. After that, thermal analysis and inductance were calculated and compared.

Finite element simulation
Power module packaging
Relative Permeability
Thermal management

http://resolver.tudelft.nl/uuid:ddbcfa30-6322-4b50-aad3-d61e386e5eec

https://doi.org/10.1109/ICEPT56209.2022.9873343

IEEE

2023-07-01

978-1-6654-9906-4

Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10 → 2022-08-13, Dalian, China

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

conference paper

© 2022 Xiao Li, Jiuyang Tang, Jiayan Zhao, Jinbing Li, Kouchi Zhang, Pan Liu