Title
Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices
Author
Du, L. (TU Delft Electronic Components, Technology and Materials)
Hu, D. (TU Delft Electronic Components, Technology and Materials) 
Poelm, René (Nexperia)
van Driel, W.D. (TU Delft Electronic Components, Technology and Materials; Signify)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Date
2023
Abstract
The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However, there are only a few studies with regard to the mechanical properties of sintered Cu. As the die-attach layer undergoes thermal and mechanical stress during its application, it is essential to investigate the micro-scale mechanical properties of sintered Cu. Fracture toughness is a measure of the resistance of a material to crack propagation under predominantly linear-elastic conditions, which is an essential parameter for predicting fracture failure. As cracks and defects are difficult to avoid during fabrication and application processing for sintered Cu, which will definitely cause a significant effect on micromechanical properties. Thus, it is essential to reveal the effect of microstructure on fracture toughess of sintered Cu nanoparticles.
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DOI
https://doi.org/10.1109/EuroSimE56861.2023.10100756
Publisher
IEEE
Embargo date
2023-10-17
ISBN
979-8-3503-4598-8
Source
Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023-04-16 → 2023-04-19, Graz, Austria
Series
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 L. Du, D. Hu, René Poelm, W.D. van Driel, Kouchi Zhang