Print Email Facebook Twitter Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip Title Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip Author Yi, H. (TU Delft Electronic Components, Technology and Materials) Öztürk, E. (Silicon Radar GmbH) Koelink, Marco (Chip Integration Technology Center) Krimmling, Jana (Silicon Radar GmbH) Damian, Andrei A. (NXP) Debski, Wojciech (Silicon Radar GmbH) van Zeijl, H.W. (TU Delft Electronic Components, Technology and Materials) Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) Poelma, René H. (TU Delft Electronic Components, Technology and Materials; Nexperia B.V.) Date 2022 Abstract High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package. Subject 0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS)film-assisted moldingmetalized polymermonostatic frequency modulated continuous-wave (FMCW) radarpatch antennasradar antenna-in-package (AiP)SU-8system-in-package (SiP)through-polymer via (TPV) To reference this document use: http://resolver.tudelft.nl/uuid:4bb660dd-31b0-4504-b467-0790dd2ae709 DOI https://doi.org/10.1109/TCPMT.2022.3172618 Embargo date 2023-07-01 ISSN 2156-3950 Source IEEE Transactions on Components, Packaging and Manufacturing Technology, 12 (6), 893-901 Bibliographical note Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type journal article Rights © 2022 H. Yi, E. Öztürk, Marco Koelink, Jana Krimmling, Andrei A. Damian, Wojciech Debski, H.W. van Zeijl, Kouchi Zhang, René H. Poelma Files PDF Antenna_in_Package_AiP_Us ... r_Chip.pdf 2.89 MB Close viewer /islandora/object/uuid:4bb660dd-31b0-4504-b467-0790dd2ae709/datastream/OBJ/view