Title
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
Author
Hu, X. (TU Delft Electronic Components, Technology and Materials; Ampleon)
Martin, H.A. (TU Delft Electronic Components, Technology and Materials; Chip Integration Technology Center)
Poelma, René H. (TU Delft Electronic Components, Technology and Materials) 
Huang, J.L. (Ampleon)
Rijckevorsel, H. (Ampleon)
Scholten, H. (Ampleon)
Smits, E.C.P. (Chip Integration Technology Center)
van Driel, W.D. (TU Delft Electronic Components, Technology and Materials)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Date
2023
Abstract
Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D reconstruction methodology for the microstructural investigation of the resin-reinforced Ag sintering material from OverMolded Plastic (OMP) packages. Based on the reconstructed models with different sintering parameters (temperature and time), the fraction of Ag and Resin volume distribution, the connectivity of silver particles, and the tortuosity factors were estimated. A 99% connectivity of sintered Ag particles was achieved with various sintering conditions, such as 200°C for 2 hours, 200°C for 4 hours, and 250°C for 2 hours. However, coarsening of Ag particles was promoted when sintered at 250°C. Increasing the sintering time at 200°C had insignificant changes. The estimated tortuosity factor also indicated that sintering at 250°C provides the shortest heat transport path between the semiconductor die and the package substrate. In order to quantify the microstructural findings, the OMP packages’ thermal performance with different sintering conditions (temperature, time, and interconnect thickness) was experimentally assessed. Although the experimental measurements were less sensitive to the effective interface thermal resistances’, the measurement results show a good correlation with the microstructural analysis. Sintering the Resin-reinforced Ag sintering material at higher temperatures (250°C) seems to improve the package thermal performance, and increasing the sintering time at 200°C has a negligible effect.
Subject
Hybrid Ag Sintering
Pressureless Sintering
3D Reconstruction
Microstructure Analysis
Tortuosity
Transient Thermal Impedance
LDMOS Body Diode Measurement
To reference this document use:
http://resolver.tudelft.nl/uuid:dafa329e-d89a-478f-90fc-ffcd86dcd134
DOI
https://doi.org/10.1109/EuroSimE56861.2023.10100799
Publisher
IEEE
Embargo date
2023-10-17
ISBN
979-8-3503-4598-8
Source
Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023-04-16 → 2023-04-19, Graz, Austria
Series
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 X. Hu, H.A. Martin, René H. Poelma, J.L. Huang, H. Rijckevorsel, H. Scholten, E.C.P. Smits, W.D. van Driel, Kouchi Zhang