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Palacios-Aguilera, N.B. (author), Bastemeijer, J. (author), Mollinger, J.R. (author), Bossche, A. (author), Mokkapati, V.R.S.S. (author), Visser, H.A. (author), Akkerman, R. (author)
Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film...
journal article 2012