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Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Light transmittance in human atrial tissue and transthoracic illumination in rats support translatability of optogenetic cardioversion of atrial fibrillation
Light transmittance in human atrial tissue and transthoracic illumination in rats support translatability of optogenetic cardioversion of atrial fibrillation
High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material
High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material
Ultrasound-Guided Optogenetic Gene Delivery for Shock-Free Ventricular Rhythm Restoration
Ultrasound-Guided Optogenetic Gene Delivery for Shock-Free Ventricular Rhythm Restoration
Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
Simulation for stability of a beam-mass based high-resolution MEMS gravimeter
Simulation for stability of a beam-mass based high-resolution MEMS gravimeter
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects
Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression
Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated
Compressive response of pristine and superconductor coated MWCNT pillars
Compressive response of pristine and superconductor coated MWCNT pillars
High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes
Designing a 100 [aF/nm] capacitive transducer
Designing a 100 [aF/nm] capacitive transducer
Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
Non-linear bulk micromachined accelerometer for high sensitivity applications
Non-linear bulk micromachined accelerometer for high sensitivity applications
High aspect ratio spiral resonators for process variation investigation and MEMS applications
High aspect ratio spiral resonators for process variation investigation and MEMS applications
Stretchable Binary Fresnel Lens for Focus Tuning
Stretchable Binary Fresnel Lens for Focus Tuning
Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
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