Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...

Modeling nonlinear moisture diffusion in inhomogeneous media

While moisture diffusion in microelectronic device and packaging has been studied for decades, the problems involving complex nonlinear moisture diffusion in multi-material assembly have not been fully studied. This paper has developed a general nonlinear diffusion model by adopting water activity, a continuous state variable, as the field...