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Establishment of the coarse grained parameters for epoxy-copper interfacial separation

Wong, C.K.Y. (author), Leung, S.Y.Y. (author), Poelma, R.H. (author), Jansen, K.M.B. (author), Yuan, C.C.A. (author), Van Driel, W.D. (author), Zhang, G. (author)

Atomistic coarse grained parameters were calculated from a non-equilibrium molecular dynamics simulation of the separation of an epoxy-copper interface. The methodology to determine the interaction energy and the equilibrium distance between the interfacial materials at a minimum energy is established. The traction-displacement relations of the...

journal article 2012

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Through-polymer via (TPV) and method to manufacture such a via

Poelma, R.H. (author), Van Zeijl, H. (author), Zhang, G. (author)

The invention relates to vias for three dimensional (3D) stacking, packaging and heterogeneous integration of semi-conductor layers and wafers. In particular, the invention relates to a process for the manufacture of a via, to a via, to a 3D circuit and to a semiconductor device. Vias are interconnects used to vertically interconnect chips,...

patent 2014

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Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Schlangen, H.E.J.G. (author), Van Zeijl, H.W. (author), Fan, X. (author), Zhang, G.Q. (author)

The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-lithographically defined CNT pillars that are conformally coated with amorphous silicon carbide (a-SiC) to strengthen the...

journal article 2014

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3D interconnect technology based on low temperature copper nanoparticle sintering

Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author)

We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...

conference paper 2016

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Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis

Silvestri, C. (author), Riccio, M. (author), Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Santagata, F. (author), Irace, A. (author), Zhang, G.Q. (author), Sarro, P.M. (author)

Thermal material properties play a fundamental role in the thermal management of microelectronic systems. The porous nature of carbon nanotube (CNT) arrays results in a very high surface area to volume ratio, which makes the material attractive for surface driven heat transfer mechanisms. Here, we report on the heat transfer performance of...

journal article 2016

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Stretchable Binary Fresnel Lens for Focus Tuning

Li, X. (author), Wei, L. (author), Poelma, René H. (author), Vollebregt, S. (author), Wei, J. (author), Urbach, Paul (author), Sarro, Pasqualina M (author), Zhang, Kouchi (author)

This paper presents a tuneable binary amplitude Fresnel lens produced by wafer-level microfabrication. The Fresnel lens is fabricated by encapsulating lithographically defined vertically aligned carbon nanotube (CNT) bundles inside a polydimethyl-siloxane (PDMS) layer. The composite lens material combines the excellent optical absorption...

journal article 2016

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High aspect ratio spiral resonators for process variation investigation and MEMS applications

Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)

In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the...

conference paper 2017

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Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes

Silvestri, C. (author), Riccio, Michele (author), Poelma, René H. (author), Jovic, A. (author), Morana, B. (author), Vollebregt, S. (author), Irace, Andrea (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)

The high aspect ratio and the porous nature of spatially oriented forest-like carbon nanotube (CNT) structures represent a unique opportunity to engineer a novel class of nanoscale assemblies. By combining CNTs and conformal coatings, a 3D lightweight scaffold with tailored behavior can be achieved. The effect of nanoscale coatings, aluminum...

journal article 2018

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Designing a 100 [aF/nm] capacitive transducer

Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), van Zeijl, H.W. (author), Wei, J. (author), Zhang, Kouchi (author), van Driel, W.D. (author)

The mechanical part of inertial sensors can be designed to have a large mechanical sensitivity, but also requires the transduction mechanism which translates this displacement. The overall system resolution in mechanical inertial sensors is dictated by the noise contribution of each stage and the magnitude of each sensitivity, see also Figure...

conference paper 2018

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Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

Huang, Z.Q. (author), Poelma, René H. (author), Vollebregt, S. (author), Koelink, M.H. (author), Boschman, E. (author), Kropf, R. (author), Gallouch, M. (author), Zhang, Kouchi (author)

This article shows the fabrication process and packaging of through polymer optical vias (TPOV). The TPOV enables encapsulation and packaging of silicon photonic systems using film assisted molding (FAM) and the creation of micron-sized through polymer optical vias. The optical vias are lithographically defined in thick film photo-resist (∼ 300...

conference paper 2018

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Non-linear bulk micromachined accelerometer for high sensitivity applications

Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author), Wei, J. (author)

This work describes the design, modelling and realisation of the mechanical part of a non-linear MEMS accelerometer intended for large displacement behaviour. For this, a mass/spring system was designed with an extremely low resonance frequency. In this work the mechanical behaviour was verified by measurements done using an optical setup,...

conference paper 2018

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Compressive response of pristine and superconductor coated MWCNT pillars

Mirza Gheytaghi, Amir (author), Vollebregt, S. (author), Poelma, René H. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)

poster 2019

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High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

el Mansouri, B. (author), Middelburg, L.M. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author), Wei, J. (author), Jiang, H. (author), Vogel, J.G. (author), van Driel, W.D. (author)

Commercially available gravimeters and seismometers can be used for measuring Earth’s acceleration at resolution levels in the order of ng∕Hz (where g represents earth’s gravity) but they are typically high-cost and bulky. In this work the design of a bulk micromachined MEMS device exploiting non-linear buckling behaviour is described, aiming...

journal article 2019

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Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated

Mirza Gheytaghi, Amir (author), Poelma, René H. (author), Sacco, L.N. (author), Vollebregt, S. (author), Zhang, Kouchi (author)

In this paper, the compressive stress of pristine and coated vertically-aligned (VA) multi-walled (MW) carbon nanotube (CNT) pillars were investigated using flat-punch nano-indentation. VA-MWCNT pillars of various diameters (30–150 µm) grown by low-pressure chemical vapor deposition on silicon wafer. A conformal brittle coating of niobium...

journal article 2020

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Ultrasound-Guided Optogenetic Gene Delivery for Shock-Free Ventricular Rhythm Restoration

Nyns, Emile C.A. (author), Jin, T. (author), Bart, Cindy I. (author), Bax, Wilhelmina H. (author), Zhang, Kouchi (author), Poelma, René H. (author), de Vries, Antoine A.F. (author), Pijnappels, Daniël A. (author)

journal article 2022

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Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model

Nyns, Emile C.A. (author), Jin, T. (author), Fontes, Magda S. (author), van den Heuvel, Titus (author), Portero, Vincent (author), Bart, Cindy I. (author), Zeppenfeld, Katja (author), Zhang, Kouchi (author), Poelma, René H. (author)

AIMS: Ventricular tachyarrhythmias (VTs) are common in the pathologically remodelled heart. These arrhythmias can be lethal, necessitating acute treatment like electrical cardioversion to restore normal rhythm. Recently, it has been proposed that cardioversion may also be realized via optically controlled generation of bioelectricity by the...

journal article 2022

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Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Yi, H. (author), Öztürk, E. (author), Koelink, Marco (author), Krimmling, Jana (author), Damian, Andrei A. (author), Debski, Wojciech (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)

High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection...

journal article 2022

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Simulation for stability of a beam-mass based high-resolution MEMS gravimeter

Ye, Guigen (author), Fan, X. (author), Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), Zhang, Kouchi (author)

In this paper, stability and mechanistic simulations for a four-beam-mass-based MEMS gravimeter were conducted, and guidelines for the gravimeter design were proposed. Based on a prototyped MEMS device, the nonlinear finite element model was validated first against the experimental results. Then, we demonstrated three different scenarios in...

journal article 2022

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Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Du, L. (author), Zhao, Xiujuan (author), Watte, Piet (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)

The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...

conference paper 2022

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Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device

Hu, X. (author), Martin, H.A. (author), Poelma, René H. (author), Huang, J.L. (author), Rijckevorsel, H. (author), Scholten, H. (author), Smits, E.C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)

Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D...

conference paper 2023