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Mao, Qi (author), Wang, Haiqing (author), Yang, M. (author), Hu, Jason (author)
Safety instrumented systems(SIS) have been widely used in petroleum and chemical plants to detect and respond to dangerous events and prevent them from developing into accidents. The in-service time of SIS does not exceed its useful life is one of the crucial assumptions of IEC functional safety standards. The testing method recommended in the...
journal article 2023
document
Cai, Miao (author), Cui, Peng (author), Qin, Yikang (author), Geng, Daoshuang (author), Wei, Qiqin (author), Wang, Xiyou (author), Yang, Daoguo (author), Zhang, Kouchi (author)
Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the...
review 2020
document
Jiang, Y. (author), Cucu Laurenciu, N. (author), Wang, H. (author), Cotofana, S.D. (author)
As CMOS scaling is reaching its limits, high power density and leakage, low reliability, and increasing IC production costs are prompting for developing new materials, devices, architectures, and computation paradigms. Additionally, temperature variations have a significant impact on devices and circuits reliability and performance. Graphene...
conference paper 2020
document
Liu, Y. (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)
Purpose: Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a)...
journal article 2019
document
Wang, Q. (author), Giustiniano, Domenico (author), Zuniga, Marco (author)
LEDs in our buildings, vehicles, and consumer products are rapidly gaining visible light communication capabilities. LED links however are notorious for being unreliable: shadowing, blockage, mobility, external light, all of these issues can disrupt the connectivity easily. Therefore, unless a reliable and cost-efficient data link layer is...
journal article 2018
document
Liu, Yang (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)
The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the thickness and the porosity of the sintering layer decreased when the sintering pressure varied from 5 MPa to 30 MPa. This densification phenomenon...
journal article 2018
document
Wang, Y. (author)
Aggressive CMOS technology feature size scaling has been going on for the past decades, while the supply voltage is not proportionally scaled. Due to the increasing power density and electric field in the gate dielectric, the accelerating factors of failure mechanisms in nanoscale Integrated Circuits (ICs) have become more severe than ever. As a...
doctoral thesis 2013
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