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Zhu, G. (author), Zhou, Y. (author), Wu, Z. (author), Tang, J. (author), Dong, B. (author), Han, N. (author), Xing, F. (author)
The microcapsules of epoxy E-51 resin encapsulated by cured itself were prepared by interfacial curing reaction, in which ethylenediamine (EDA) was employed as curing agent and sulfonated copolymer of styrene and maleic anhydride (SMA) as emulsifying agent. ItÂ’s found the morphology of microcapsules strongly depend on reaction time and EDA...
conference paper 2013