Multi-Scale Material and Technology for Heterogeneous Integration

This thesis describes a series of experiments and fabrication methods on high-aspect-ratio 3D microstructures for wafer level packaging and 3D heterogeneous system integration (3D-HSI) using novel materials such as carbon nanotubes and thick-film photo-resists. Furthermore, theoretical and experimental research efforts are made to understand the...

Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-lithographically defined CNT pillars that are conformally coated with amorphous silicon carbide (a-SiC) to strengthen the...