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Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, G.Q. (author)
Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...
conference paper 2018
document
Sharma, Rahul (author), Zhang, J. (author), Langelaar, M. (author), van Keulen, A. (author), Aragon, A.M. (author)
In this paper, we propose a stress recovery procedure for low-order finite elements in 3D. For each finite element, the recovered stress field is obtained by satisfying equilibrium in an average sense and by projecting the directly calculated stress field onto a conveniently chosen space. Compared with existing recovery techniques, the...
journal article 2018
document
Zhang, Youyou (author), Liu, Yuqing (author), Xin, H. (author), He, Jun (author)
Steel-concrete composite high bridge pier has been applied increasingly in China and around the world. Most applied steel type in the composite piers are H-shaped steel and steel pipe, while seldom research or practice is associated with angle steel. This paper conducted parametric study on the composite column with equal-leg angle steel and...
journal article 2019