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Janssen, G.C.A.M. (author), Dammers, A.J. (author), Sivel, V.G.M. (author), Wang, W.R. (author)
Thin films on substrates are usually in a stressed state. An important, but trivial, contribution to that stress stems from the difference in thermal expansion coefficient of substrate and film. Much more interesting are the intrinsic stresses, resulting from the growth and/or microstructure of the film. Intrinsic compressive stress was...
journal article 2003
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Janssen, G.C.A.M. (author), Kamminga, J.D. (author)
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shrinkage and compressive stress is caused by ion peening. It is shown that the two contributions are additive. Moreover tensile stress generated at the grain boundaries does not relax by ion bombardment. In polycrystalline hard metal films the grain...
journal article 2004
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Grachev, S.Y. (author), Tichelaar, F.D. (author), Janssen, G.C.A.M. (author)
We studied the tensile stress and grain-width evolution in sputter-deposited Cr films with thickness from 20?nm to 2.7??m. Films were deposited in an industrial Hauzer 750 physical vapor deposition machine at 50–80?°C. The films exhibited a columnar microstructure. A power law behavior of the tensile stress as well as of the average grain width...
journal article 2005
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Pujada, B.R. (author), Tichelaar, F.D. (author), Janssen, G.C.A.M. (author)
Tungsten carbide-diamond like carbon (WC-DLC) multilayer coatings have been prepared by sputter deposition from a tungsten-carbide target and periodic switching on and off of the reactive acetylene gas flow. The stress in the resulting WC-DLC multilayers has been studied by substrate curvature. Periodicity and microstructure have been studied by...
journal article 2007
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