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Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, R.H. (author), Zhang, G.Q. (author), van Zeijl, H.W. (author)
We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...
conference paper 2016