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Mechanical Characterization of III-V Nanowire Using Molecular Dynamics Simulation
The chemical-mechanical relationship of the SiOC(H) dielectric film
Multi-scale energy-based failure modeling of bond pad structures
Thermomechanical Multiscale Modelling of Substrates
Combined Virtual Prototyping and Reliability Testing Based Design Rules for Stacked Die System in Packages
Thin Film Interface Fracture Properties at Scales Relevant to Microelectronics
Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices
Establishment of the coarse grained parameters for epoxy-copper interfacial separation
Reliability and Lifetime Prediction of Remote Phosphor Plates in Solid-State Lighting Applications Using Accelerated Degradation Testing
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