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A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation
Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition
Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
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