Mechanical characterization and modeling of curing thermosets

Chemical shrinkage and simultaneous build-up of mechanical properties in curing thermosets leads to the build-up of residual stresses and strains. Depending on the constraints these may cause interface failure, dimensional inaccuracy or failure in the thermoset or its surrounding structure. The present work aims at both an improved methodology...

Massivizing Networked Virtual Environments on Clouds

Networked Virtual Environments (NVEs) are virtual environments where physically distributed, Internet-connected users can interact and socialize with others. The most popular NVEs are online games, which have hundreds of millions of users and a global market of tens of billions Euros per year. Besides entertainments, NVE techniques are used in...

Characterization and Compact Modeling of Nanometer CMOS Transistors at Deep-Cryogenic Temperatures

Cryogenic characterization and modeling of two nanometer bulk CMOS technologies (0.16-μm and 40-nm) are presented in this paper. Several devices from both technologies were extensively characterized at temperatures of 4 K and below. Based on a detailed understanding of the device physics at deep-cryogenic temperatures, a compact...