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Yuan, Ye (author), Tang, Xiuchuan (author), Zhou, Wei (author), Pan, W. (author), Li, Xiuting (author), Zhang, Hai Tao (author), Ding, Han (author), Goncalves, Jorge (author)
Cyber-physical systems embed software into the physical world. They appear in a wide range of applications such as smart grids, robotics, and intelligent manufacturing. Cyber-physical systems have proved resistant to modeling due to their intrinsic complexity arising from the combination of physical and cyber components and the interaction...
journal article 2019
document
Zhu, G. (author), Zhou, Y. (author), Wu, Z. (author), Tang, J. (author), Dong, B. (author), Han, N. (author), Xing, F. (author)
The microcapsules of epoxy E-51 resin encapsulated by cured itself were prepared by interfacial curing reaction, in which ethylenediamine (EDA) was employed as curing agent and sulfonated copolymer of styrene and maleic anhydride (SMA) as emulsifying agent. It’s found the morphology of microcapsules strongly depend on reaction time and EDA...
conference paper 2013
document
Zhu, G. (author), Wu, Z. (author), Zhou, Y. (author), Tang, J. (author), Dong, B. (author), Han, N. (author), Xing, F. (author)
Epoxy E-51/UF resin microcapsules were prepared by traditional two-stepped in situ polymerization method and processing parameters affecting the final microcapsules’ shape and size were carefully studied in the aim to obtain microcapsule with ideally spherical shape and uniform size. It’s found the polycarboxylate surfactant of SMA (styrene...
conference paper 2013
document
Tang, H. (author), Janic, M. (author), Zhou, X. (author)
conference paper 2006
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