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Janssen, G.C.A.M. (author), Tichelaar, F.D. (author), Visser, C.C.G. (author)
Stress in hard films is the net sum of tensile stress generated at the grain boundaries, compressive stress due to ion peening, and thermal stress due to the difference in thermal expansion of the coating and substrate. The tensile part due to grain boundaries is thickness dependent. The other two contributions are not thickness dependent....
journal article 2006
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Janssen, G.C.A.M. (author), Kamminga, J.D. (author)
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shrinkage and compressive stress is caused by ion peening. It is shown that the two contributions are additive. Moreover tensile stress generated at the grain boundaries does not relax by ion bombardment. In polycrystalline hard metal films the grain...
journal article 2004
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Grachev, S.Y. (author), Tichelaar, F.D. (author), Janssen, G.C.A.M. (author)
We studied the tensile stress and grain-width evolution in sputter-deposited Cr films with thickness from 20?nm to 2.7??m. Films were deposited in an industrial Hauzer 750 physical vapor deposition machine at 50–80?°C. The films exhibited a columnar microstructure. A power law behavior of the tensile stress as well as of the average grain width...
journal article 2005