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Hou, F. (author), Wang, W. (author), Lin, Tingyu (author), Cao, Liqiang (author), Zhang, G.Q. (author), Ferreira, J.A. (author)
In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature...
journal article 2019