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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Luopan, Yaxin (author), Han, Rui (author), Zhang, Qinglong (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)
Deep Neural Networks (DNNs) have been ubiquitously adopted in internet of things and are becoming an integral of our daily life. When tackling the evolving learning tasks in real world, such as classifying different types of objects, DNNs face the challenge to continually retrain themselves according to the tasks on different edge devices....
conference paper 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...
conference paper 2023
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Liu, Minne (author), Ibrahim, Mesfin S. (author), Wen, Minzhen (author), Li, Sheng (author), Wang, An (author), Zhang, Kouchi (author), Fan, J. (author)
Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...
conference paper 2023
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Ji, Liangzheng (author), Li, Zaihuan (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
Micro LED displays offer superior performance compared to traditional LCD and OLED displays. However, challenges in transfer technology, such as high throughput and scalability, must be addressed. Among various mass transfer techniques, stamp transfer and laser-assisted transfer are widely used for Micro LED assembly. The laser-assisted transfer...
conference paper 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...
conference paper 2023
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Zhang, Qinglong (author), Han, Rui (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)
Vision applications powered by deep neural networks (DNNs) are widely deployed on edge devices and solve the learning tasks of incoming data streams whose class label and input feature continuously evolve, known as domain shift. Despite its prominent presence in real-world edge scenarios, existing benchmarks used by domain adaptation methods...
conference paper 2023
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Liu, Y.L. (author), Ortiz, Marco A. (author), Zhang, D. (author), Bluyssen, P.M. (author)
The airborne transmission of SARS-CoV-2 in educational buildings has raised concerns during the current COVID-19 pandemic. In this study, a portable fog generator system was designed and assembled to visualise the airflow pattern of exhaled droplets in a classroom. The system consists of five components: medium, fog generator, buffer, pump, and...
conference paper 2022
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Liu, Qilong (author), Breems, Lucien (author), Zhang, Chenming (author), Bajoria, Shagun (author), Bolatkale, M. (author), Rutten, Robert (author), Radulov, Georgi (author)
In the pursuit of ever larger bandwidths, in recent years GHz-rate continuous-time (CT) oversampled ADCs have been reported in literature that achieve bandwidths of hundreds of MHz and have even exceeded the GHz barrier [1]-[3]. As impressive as these bandwidths are for CT ADCs, the required ADC architectures are complex, are sensitive to...
conference paper 2022
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Ji, X. (author), van Zeijl, H.W. (author), Romijn, J. (author), van Ginkel, H.J. (author), Liu, X. (author), Zhang, Kouchi (author)
The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...
conference paper 2022
document
Wang, Xinyue (author), Zeng, Zejun (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)
With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...
conference paper 2022
document
Tan, C. (author), Wang, S. (author), Liu, X. (author), Jiang, Jing (author), Zhang, Kouchi (author), Ye, H. (author)
On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...
conference paper 2022
document
Li, Shizhen (author), Liu, X. (author), Jiang, Jing (author), Tan, C. (author), Gao, Chenshan (author), Liu, Yang (author), Ye, H. (author), Zhang, Kouchi (author)
Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...
conference paper 2022
document
Ji, Liangzheng (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits...
conference paper 2022
document
Gao, Hanyan (author), Zhang, Jing (author), Zhu, Yingcan (author), Guo, Ruiqian (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Liu, Pan (author)
With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...
conference paper 2022
document
Chen, Haixue (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)
Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes...
conference paper 2022
document
Li, Xiao (author), Tang, Jiuyang (author), Zhao, Jiayan (author), Li, Jinbing (author), Zhang, Kouchi (author), Liu, Pan (author)
With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a...
conference paper 2022
document
Lv, Guoping (author), Yan, Haidong (author), Yan, Haidong (author), Yang, Daoguo (author), Wu, Xinke (author), Sheng, Kuang (author), Liu, Chaohui (author), Zhang, Yakun (author), Zhang, Kouchi (author)
As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...
conference paper 2022
document
Zuo, Chenjia (author), Zhang, Yixiang (author), Tong, Yudong (author), Liu, Yanbo (author)
Synthetic fibers have been widely studied as reinforcing materials to increase the mechanical and durability properties of concrete. According to its diameter, fibers can be categorized as micro and macro (or coarse) fibers. As most research focuses on the mechanical properties of fiber reinforced concrete, its chloride permeability properties...
conference paper 2021
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Liu, Hexin (author), Perera, Leibny Paola Garcia (author), Zhang, Xinyi (author), Dauwels, J.H.G. (author), Khong, Andy W.H. (author), Khudanpur, Sanjeev (author), Styles, Suzy J. (author)
We propose two end-to-end neural configurations for language diarization on bilingual code-switching speech. The first, a BLSTM-E2E architecture, includes a set of stacked bidirectional LSTMs to compute embeddings and incorporates the deep clustering loss to enforce grouping of languages belonging to the same class. The second, an XSA-E2E...
conference paper 2021
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