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Tang, H. (author), Ye, Huai-Yu (author), Chen, Xian Ping (author), Qian, Cheng (author), Fan, Xuejun (author), Zhang, G.Q. (author)
In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...
journal article 2017