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Zhu, G. (author), Wu, Z. (author), Zhou, Y. (author), Tang, J. (author), Dong, B. (author), Han, N. (author), Xing, F. (author)
Epoxy E-51/UF resin microcapsules were prepared by traditional two-stepped in situ polymerization method and processing parameters affecting the final microcapsules’ shape and size were carefully studied in the aim to obtain microcapsule with ideally spherical shape and uniform size. It’s found the polycarboxylate surfactant of SMA (styrene...
conference paper 2013
document
Zhu, G. (author), Lü, L. (author), Tang, J. (author), Dong, B. (author), Han, N. (author), Xing, F. (author)
For epoxy microcapsules embedded in concrete as mechanic-triggered self-healing adhesive, globular shape with uniform size is the basic requirement to ensure the solid shell broken and the liquid core released at a designed stress. In this paper, monodispersed melamine–formaldehyde (MF) resin-walled epoxy E-51 microcapsules were successfully...
conference paper 2013
document
Zhang, M. (author), Han, N. (author), Xing, F. (author), Wang, X. (author), Schlangen, H.E.J.G. (author)
For a microcapsule based self-healing system in the cementitious material, a fundamental issue is to find and facilitate a suitable microcapsule system, concerning either the material selection or design and manufacture process. In this study, urea formaldehyde resin is used for the shell of microcapsule, and bisphenol – an epoxy resin E-51...
conference paper 2013
document
Zhang, M. (author), Han, N. (author), Xing, F. (author), Schlangen, H.E.J.G. (author)
For a microcapsule based self-healing system in the cementitious material, a fundamental issue is to find and facilitate a suitable microcapsule system, concerning either the material selection or design and manufacture process. In this study, urea formaldehyde resin is used for the shell of microcapsule, and bisphenol – an epoxy resin E-51...
conference paper 2013
document
Zhu, G. (author), Zhou, Y. (author), Wu, Z. (author), Tang, J. (author), Dong, B. (author), Han, N. (author), Xing, F. (author)
The microcapsules of epoxy E-51 resin encapsulated by cured itself were prepared by interfacial curing reaction, in which ethylenediamine (EDA) was employed as curing agent and sulfonated copolymer of styrene and maleic anhydride (SMA) as emulsifying agent. It’s found the morphology of microcapsules strongly depend on reaction time and EDA...
conference paper 2013
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