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Martin, H.A. (author), Smits, Edsger C.P. (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This article introduces an online condition monitoring strategy that utilizes a transient heat pulse to detect package thermal performance degradation. The metric employed is the temperature-dependent transient thermal impedance "Zth(t, Tamb)."The proposed methodology offers quantitative insights into package thermal performance degradation...journal article 2024
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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...conference paper 2024
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Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...conference paper 2024
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Inamdar, A.S. (author), van Soestbergen, Michiel (author), Mavinkurve, Amar (author), van Driel, W.D. (author), Zhang, Kouchi (author)Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...conference paper 2023
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Yazdan Mehr, M. (author), Hajipour, Pejman (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Cooremans, Thierry (author), De Buyl, Francois (author), Zhang, Kouchi (author)Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing...conference paper 2023
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Martin, H.A. (author), Reintjes, Marcia (author), Reijs, Dave (author), Dorrestein, Sander (author), Kengen, Martien (author), Libon, Sebastien (author), Smits, Edsger (author), Tang, Xiao (author), Koelink, Marco (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the...conference paper 2023
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Thukral, V. (author), Bacquet, Irene (author), Van Soestbergen, Michiel (author), Zaal, Jeroen (author), Roucou, Romuald (author), Rongen, Rene (author), van Driel, W.D. (author), Zhang, Kouchi (author)Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature...conference paper 2023
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Du, L. (author), Zhao, Xiujuan (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...conference paper 2023
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Inamdar, A.S. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Digital Twin can be broadly described as a continuously updated virtual representation of an object, system, or process which replicates all phases in the lifecycle of its physical counterpart. Originally conceptualized in 2003 [1], the term `Digital Twin' came into existence after it first appeared in NASA's roadmap in 2010 [2]. The concept...conference paper 2023
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Du, L. (author), Hu, D. (author), Poelm, René (author), van Driel, W.D. (author), Zhang, Kouchi (author)The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However,...conference paper 2023
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Hu, X. (author), Martin, H.A. (author), Poelma, René H. (author), Huang, J.L. (author), Rijckevorsel, H. (author), Scholten, H. (author), Smits, E.C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D...conference paper 2023
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Sun, B. (author), Mo, J. (author), Zhang, Hemin (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The...conference paper 2023
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Thukral, V. (author), van Soestbergen, M. (author), Zaal, J.J.M. (author), Roucou, R. (author), Rongen, R.T.H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Board level vibration testing is intended to assess prediction of the reliability of solder joint interconnects that are formed between electronic components and printed circuit boards (PCB). Frailties in the stress test experiment might lead to false board level reliability (BLR) evaluations. Therefore, it is essential to have a well...review 2022
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...conference paper 2022
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Du, L. (author), Zhao, Xiujuan (author), Watte, Piet (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...conference paper 2022
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van Driel, W.D. (author), Yazdan Mehr, M. (author), Fan, X. J. (author), Zhang, Kouchi (author)In the foregoing chapters, the reliability of organic compounds in microelectronics and optoelectronics was discussed. It provided a state of the art in reliability concepts for materials used in electronic products. It also enlightened the direction in reliability concepts for these products. In this chapter, we discuss the outlook where we...book chapter 2022
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Yazdan Mehr, M. (author), van Driel, W.D. (author), Zhang, Kouchi (author)In this chapter, degradation mechanisms of optical materials, used in the light-emitting diode (LED)-based products, are explained. This chapter aims at describing the service conditions on the degradation mechanisms of different organic optical materials in LEDs which lead to the color shift of the light output. The contributions of different...book chapter 2022
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Tan, C. (author), Gao, Chenshan (author), Zhou, Quan (author), van Driel, W.D. (author), Ye, H. (author), Zhang, Kouchi (author)The authors regret that one of the affiliations (affiliation f) was incorrectly omitted in the original manuscript. The corrected list of affiliations is as shown below. The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.journal article 2021
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Hajipour, Pejman (author), Bahrami, Abbas (author), Yazdan Mehr, M. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This paper investigates the photocatalytic characteristics of Ag nanowire (AgNW)/TiO2 and AgNW/TiO2/graphene oxide (GO) nanocomposites. Samples were synthesized by the direct coating of TiO2 particles on the surface of silver nanowires. As-prepared AgNW/TiO2 and AgNW/TiO2/GO nanocomposites were characterized by electron microscopy, X-ray...journal article 2021
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Ibrahim, Mesfin Seid (author), Fan, J. (author), Yung, Winco K.C. (author), Jing, Zhou (author), Fan, Xuejun (author), van Driel, W.D. (author), Zhang, Kouchi (author)The increased system complexity in electronic products brings challenges in a system level reliability assessment and lifetime estimation. Traditionally, the graph model-based reliability block diagrams (RBD) and fault tree analysis (FTA) have been used to assess the reliability of products and systems. However, these methods are based on...journal article 2021