Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Durable lubricant-infused anodic aluminum oxide surfaces with high-aspect-ratio nanochannels

Recently, lubricant-infused surfaces (LIS) have emerged as a prominent class of surface technology for antifouling, anti-icing and anticorrosion applications. However, long-term corrosion exposure and mechanical damages may deteriorate the practical performance of LIS during application. In this study, a robust LIS was fabricated by the...