Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material

In this paper we propose a new multistep characterisation method to be able to map out the dependency of moisture diffusion parameters of a polymeric material over a range of temperature and humidity conditions in a limited amount of time. We do that by (1) using a moisture sorption analyser which can continuously monitor weight changes with...

Effect of Atmospheric Pressure Plasma Modification on Polyimide and Adhesive Joining with Titanium

This investigation highlights the effect of surface modification on polyimide by atmospheric pressure plasma treatment with different exposure time. Surface modification of polymer by plasma treatment essentially creates physical and chemical changes such as cross-linking and formation of free radicals. It also forms oxygen functionalization in...

Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

In this investigation surface treatment of titanium is carried out by plasma ion implantation under atmospheric pressure plasma in order to increase the adhesive bond strength. Prior to the plasma treatment, titanium surfaces were mechanically treated by sand blasting. It is observed that the contact angle of de-ionized water decreases with the...

Effect of chain flexibility in the network structure on the viscoelasticity of epoxy thermosets

In this paper a detailed study in investigating the effect of the chain flexibility in epoxy-amine crosslinked network is done. In order to introduce flexibility into the crosslinked network a homologous series of four aliphatic diamine curing agents varying only in the chain length and having a constant functionality (f?=?4) is taken and cured...

Ultra-Thin Deformable Silicon Substrates with Lateral Segmentation and Flexible Metal Interconnect

Our progress in developing technology modules for deformable single-crystalline-silicon electronics is presented in this contribution. Additional deformability/reliability is accomplished by modifications of the previously reported ultra-thin and flexible CIRCONFLEX technology (1). The flexibility is added in the last steps of the process flow...

Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer