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Liu, Minne (author), Li, Wenyu (author), Chen, Wei (author), Ibrahim, Mesfin S. (author), Xiong, Jingkang (author), Zhang, Kouchi (author), Fan, Jiajie (author)
During the operation of an LED array, its thermal and optical performances are always not equal to the superposition of the individual LED's characteristics because of a significant thermal coupling effect between the arrays. Based on this, this paper proposes an electrical–photo-thermal model, with considering both junction temperature and...
journal article 2024
document
Cao, Yixing (author), Chen, Wei (author), Du, Yunjia (author), Qi, Gaojin (author), Santos, Thebano (author), Zhang, Kouchi (author), Fan, J. (author)
YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rapidly when excited by high-power-density blue-laser. To explore...
journal article 2022
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Fan, J. (author), Wu, Jie (author), Jiang, Changzhen (author), Zhang, H. (author), Ibrahim, M.S. (author), Deng, Liang (author)
To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and...
journal article 2020
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Fan, J. (author), Wang, Zhen (author), Zhang, Xunwei (author), Deng, Zentao (author), Fan, Xuejun (author), Zhang, Kouchi (author)
In a high-power white light emitting diode (LED) package, the phosphor/silicone composite is typically used for photometric and colorimetric conversions, ultimately producing the white light. However, the phosphor/silicone composite is always exposed under harsh environments with high temperature, high blue light irradiation and high moisture...
journal article 2019
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Chen, Wei (author), Fan, J. (author), Qian, Cheng (author), Pu, Bin (author), Fan, Xuejun (author), Zhang, Kouchi (author)
The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux...
journal article 2019
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Yazdan Mehr, M. (author), Vollebregt, S. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
A graphene monolayer has been successfully coated on one side of a bisphenol-A-polycarbonate (BPA-PC) plate, used as a substrate for remote phosphor applications in light-emitting diode (LED)-based products. Using a photoresist transferring method, graphene sheet has been coated on BPA-PC plates. The results show that this graphene monolayer...
journal article 2017
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Qian, Cheng (author), Fan, Jiajie (author), Fang, Jiayi (author), Yu, Chaohua (author), Ren, Y. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in...
journal article 2017
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