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Chen, Wei (author), Fan, J. (author), Qian, Cheng (author), Pu, Bin (author), Fan, Xuejun (author), Zhang, G.Q. (author)
The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux...
journal article 2019
document
Yang, Ning (author), Yang, Daoguo (author), Zhang, G.Q. (author), Chen, Liangbiao (author), Liu, Dongjing (author), Cai, Miao (author), Fan, Xuejun (author)
The effects of graphene stacking are investigated by comparing the results of methane adsorption energy, electronic performance, and the doping feasibility of five dopants (i.e., B, N, Al, Si, and P) via first-principles theory. Both zigzag and armchair graphenes are considered. It is found that the zigzag graphene with Bernal stacking has...
journal article 2018
document
Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, G.Q. (author)
Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...
conference paper 2018
document
Tang, H. (author), Ye, Huai-Yu (author), Chen, Xian Ping (author), Qian, Cheng (author), Fan, Xuejun (author), Zhang, G.Q. (author)
In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...
journal article 2017
document
Chen, Liangbiao (author), Zhou, Jiang (author), Chu, Hsing-Wei (author), Zhang, G.Q. (author), Fan, Xuejun (author)
While moisture diffusion in microelectronic device and packaging has been studied for decades, the problems involving complex nonlinear moisture diffusion in multi-material assembly have not been fully studied. This paper has developed a general nonlinear diffusion model by adopting water activity, a continuous state variable, as the field...
journal article 2017
document
Tang, H. (author), Ye, H. (author), Wong, K.Y. (author), Leung, Stanley (author), Fan, Jiajie (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, G.Q. (author)
The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the...
journal article 2017
document
Chen, Xianping (author), Ye, H. (author), Fan, Xuejun (author), Ren, Tian-Ling (author), Zhang, G.Q. (author)
Heat pipes (HPs) have received considerable attention in recent decades, especially in the field of cooling electronics, which requires the removal of added heat from an area of limited volume to the environment. Small HPs are widely used in electronic applications, which are normally limited by the compact structure and dimensions of the...
journal article 2016
document
Ye, H. (author), Leung, Stanley (author), Wong, K.Y. (author), Chen, Xianping (author), Lin, Kai (author), Fan, J. (author), Kjelstrup, Signe (author), Fan, Xuejun (author), Zhang, G.Q. (author)
Using the analogue of the electric inductance, we reveal the properties of the thermal inductance in GaN-based light-emitting diode devices by testing their transient thermal behaviors. We find that the devices exhibit a transient thermal response under step-down or step-up currents and observe notable inductive phenomena of the temperature...
journal article 2016
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