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Liu, Y. (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, G.Q. (author), Sun, Fenglian (author)
Purpose: Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a)...
journal article 2019
document
Wang, Q. (author), Giustiniano, Domenico (author), Zuñiga Zamalloa, M.A. (author)
LEDs in our buildings, vehicles, and consumer products are rapidly gaining visible light communication capabilities. LED links however are notorious for being unreliable: shadowing, blockage, mobility, external light, all of these issues
can disrupt the connectivity easily. Therefore, unless a reliable and cost-efficient data link layer is...
journal article 2018
document
Liu, Yang (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, G.Q. (author), Sun, Fenglian (author)
The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the thickness and the porosity of the sintering layer decreased when the sintering pressure varied from 5 MPa to 30 MPa. This densification phenomenon...
journal article 2018
document
Wang, Y. (author)
Aggressive CMOS technology feature size scaling has been going on for the past decades, while the supply voltage is not proportionally scaled. Due to the increasing power density and electric field in the gate dielectric, the accelerating factors of failure mechanisms in nanoscale Integrated Circuits (ICs) have become more severe than ever. As a...
doctoral thesis 2013
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