- document
- Van Zeijl, P.T.M. (author) doctoral thesis 1990
- document
- Kindt, W.J. (author), Van Zeijl, H.W. (author) journal article 1998
- document
-
Laane, R.W.P.M. (author), Yland, E.M.L. (author), Van Zeijl, W.J.M. (author)In de periode 1991-1998 zijn er, naast het reguliere monitoringprogramma (MWTL), additionele locaties bemonsterd voor opgelost anorganisch stikstof (DIN) en fosfaat (DIP) door Directie Noordzee. In deze nota wordt de vraag beantwoord of deze extra monsters nu ook meer informatie hebben gegeven. Meer specifiek zijn de vragen: is de trend in de...report 1999
- document
-
Van Zeijl, W.J.M. (author), Akhlat, A. (author), Kortekaas, M.L. (author), Swertz, O.C. (author)The Netherlands participates in the Joint Assessment and Monitoring Programme (JAMP) of the Oslo and Paris Commissions. This report gives the results of the Dutch contribution to the programme for the year 1999. An overview of the national JAMP programme is given in figure 1. This figure is a map of the Dutch part of the continental shelf...report 2001
- document
-
Van Zeijl, W.J.M. (author), Akhiat, A. (author)The Netherlands participates in the Joint Assessment and Monitoring Programme (JAMP) of the Oslo and Paris Commissions. This report gives the results of the Dutch contribution to the programme for the year 2000. An overview of the national JAMP programme is given in figure 1. This figure is a map of the Dutch part of the continental shelf...report 2002
- document
-
Van Zeijl, H.W. (author), Bijnen, F.G.C. (author), Slabbekoorn, J. (author)To validate the Front- To Backwafer Alignment (FTBA) calibration and to investigate process related overlay errors, electrical overlay test structures are used that requires FTBA [1]. Anisotropic KOH etch through the wafer is applied to transfer the backwafer pattern to the frontwafer. Consequently, the crystal orientation introduces an overlay...conference paper 2004
- document
-
Smeets, E.M.J. (author), Bijnen, F.C.G. (author), Slabbekoorn, J. (author), Van Zeijl, H.W. (author)In the MEMS world, increasing attention is being given to 3D devices requiring dual-sided processing. This requires lithography tools that are able to align a wafer to both its back side as front side. Overlay describes how well front and back side layers are positioned with respect to each other. Currently there is no simple and fast method to...conference paper 2004
- document
- Paalvast, S.L. (author), Van Zeijl, H.W. (author), Su, J. (author), Sarro, P.M. (author), Van Eijk, J. (author) journal article 2007
- document
- Van Zeijl, H.W. (author), Sarro, P.M. (author) journal article 2010
- document
-
Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Maury, P. (author), Sarro, P.M. (author)Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and...journal article 2010
- document
-
Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Sarro, P.M. (author)Lithography as developed for IC device fabrication is a high volume high accuracy patterning technology with strong 2 dimensional (2D) characteristics. This 2D nature makes it a challenge to integrate this technology in a 3 dimensional (3D) manufacturing environment. This article addresses the performance of a waferstepper (ASML PAS5000) in...journal article 2010
- document
- Lafont, U. (author), Van Zeijl, H.W. (author), Van der Zwaag, S. (author) conference paper 2011
- document
-
Wei, J. (author), Ye, H. (author), Van Zeijl, H.W. (author), Sarro, P.M. (author), Zhang, G.Q. (author)A micro-electro-mechanical-system (MEMS) based, temperature triggered, switch is developed as a cost-effective solution for smart cooling control of solid-state-lighting systems. The switch (1.0x0.4 mm2) is embedded in a silicon substrate and fabricated with a single-mask 3D micro-machining process. The device switches on at a designed...journal article 2012
- document
-
Lafont, U.L. (author), Van Zeijl, H. (author), Van der Zwaag, S. (author)In this work, we investigate the formation of self-healing systems that are able to recover more than once more than one (mechanical or other physical) functionality. To this aim composites were created consisting of a polysulfide thermoset rubber matrix having intrinsic self-healing properties filled with thermally/electrically conductive...conference paper 2013
- document
-
Lafont, U.L. (author), Van Zeijl, H.W. (author), Van der Zwaag, S. (author)While conventional self healing materials focus on the restoration of mechanical properties, newer generations of self healing materials focus on the restoration of other functional (i.e. non-mechanical) properties. Thermal conductivity is an example of an important functional property of a Thermal Interface Material (TIM) for LED’s and...conference paper 2013
- document
-
Lafont, U. (author), Van Zeijl, H.W. (author), Van der Zwaag, S. (author)While conventional self healing materials focus on the restoration of mechanical properties, newer generations of self healing materials focus on the restoration of other functional (i.e. non-mechanical) properties. Thermal conductivity is an example of an important functional property of a Thermal Interface Material (TIM) for LEDs and...conference paper 2013
- document
-
Lafont, U. (author), Van Zeijl, H. (author), Van der Zwaag, S. (author)In this work, we investigate the formation of self-healing systems that are able to recover more than once more than one (mechanical or other physical) functionality. To this aim composites were created consisting of a polysulfide thermoset rubber matrix having intrinsic self-healing properties filled with thermally/electrically conductive...conference paper 2013
- document
-
Poelma, R.H. (author), Van Zeijl, H. (author), Zhang, G. (author)The invention relates to vias for three dimensional (3D) stacking, packaging and heterogeneous integration of semi-conductor layers and wafers. In particular, the invention relates to a process for the manufacture of a via, to a via, to a 3D circuit and to a semiconductor device. Vias are interconnects used to vertically interconnect chips,...patent 2014
- document
-
Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Schlangen, H.E.J.G. (author), Van Zeijl, H.W. (author), Fan, X. (author), Zhang, G.Q. (author)The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-lithographically defined CNT pillars that are conformally coated with amorphous silicon carbide (a-SiC) to strengthen the...journal article 2014