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Luo, Bixiong (author), Zhang, Li (author), Peng, Kaijun (author), Ren, Zongdong (author), Li, Xiaoyu (author), Sun, Yanqian (author), Cai, Yanfeng (author), Tu, Jin (author)
conference paper 2024
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Cao, Jianpeng (author), Zhang, Hang (author), Pan, Bo (author), Soman, R. K. (author), Savov, Anton (author), Hall, Daniel M. (author)
Design for manufacturing and assembly (DfMA) is an engineering methodology which aims to increase ease of manufacture and efficiency of assembly by considering manufacturing and assembly constraints in the design process. However, current DfMA approaches in the construction sector are not automated enough to identify the design features that...
conference paper 2024
document
Krasnov, O.A. (author), Zhang, Q. (author), Yarovoy, Alexander (author)
In this paper, the full calibration chain of FMCW radar with simultaneous transmission of two orthogonally polarized orthogonal waveforms is considered. Specifically for this type of polarimetric radar, compensation of signals’ biases and equalization of the amplification gains of the parallel polarimetric channels in the receiver are jointly...
conference paper 2024
document
Zhao, Y. (author), Zhang, Y. (author), Tao, Q. (author)
Deep learning-based methods have achieved prestigious performance for magnetic resonance imaging (MRI) reconstruction, enabling fast imaging for many clinical applications. Previous methods employ convolutional networks to learn the image prior as the regularization term. In quantitative MRI, the physical model of nuclear magnetic resonance...
conference paper 2024
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Li, Xinqi (author), Zhang, Y. (author), Zhao, Y. (author), van Gemert, J.C. (author), Tao, Q. (author)
Quantitative cardiac magnetic resonance imaging (MRI) is an increasingly important diagnostic tool for cardiovascular diseases. Yet, co-registration of all baseline images within the quantitative MRI sequence is essential for the accuracy and precision of quantitative maps. However, co-registering all baseline images from a quantitative...
conference paper 2024
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Mo, J. (author), Schaffar, Gerald J.K. (author), Du, L. (author), Maier-Kiener, Verena (author), Kiener, Daniel (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and...
conference paper 2024
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Zhou, Yimin (author), Gillavry, Merlijn Mac (author), Yang, Pengzhi (author), Xu, Zihao (author), Zhang, Baitian (author), Bidarra, Rafael (author)
As one of the most disruptive human-computer interaction techniques, Virtual Reality (VR) provides a novel way to examine human movements, e.g. when investigating Body Ownership (BO) in the field of cognitive sciences, especially when the visual output diverges from real-world actions. Previous research in BO uses questionnaires and brain...
conference paper 2024
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Cambaz, Doga (author), Zhang, X. (author)
The recent emergence of LLM-based code generation models can potentially transform programming education. To pinpoint the current state of research on using LLM-based code generators to support the teaching and learning of programming, we conducted a systematic literature review of 21 papers published since 2018. The review focuses on (1) the...
conference paper 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)
Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...
conference paper 2024
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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
document
Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Wang, Wenbo (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...
conference paper 2024
document
Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...
conference paper 2024
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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...
conference paper 2024
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Martin, H.A. (author), Xu, Haojia (author), Smits, Edsger C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varied substrate metallizations subjected to thermal cycling. Four...
conference paper 2024
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Inamdar, A.S. (author), Hauck, Torsten (author), van Soestbergen, Michiel (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Model order reduction techniques are developed and utilized to make numerical simulations more efficient. The use of Reduce Order Models (ROM) also enables data exchange with external parties without disclosing the sensitive information present in a Full-Order Model (FOM). It is crucial to optimize for both the efficiency and accuracy of a ROM...
conference paper 2024
document
Tang, Hongyu (author), Shi, Weiqi (author), Zhang, Rongjun (author), Fan, J. (author), Zhang, Kouchi (author)
Tungsten disulfide (WS2) has recently attracted considerable attention owing to its excellent physical, chemical, electronic, and optical properties, leading to increased research into its applications in electronic and optoelectronic devices. However, the oxidation of 2D material affects significantly its optical and electronic properties...
conference paper 2024
document
Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...
conference paper 2024
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Du, L. (author), Deng, Shanliang (author), Cui, Z. (author), Poelma, René H. (author), Beelen-Hendrikx, Caroline (author), Zhang, Kouchi (author)
In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the electromigration properties of solder bumps in WLCSP. A numerical model considering current density, vacancy concentration, stress and temperature was utilized to calculate...
conference paper 2024
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Ferrari, Oriana Isabella (author), Zhang, Feiran (author), Braam, Ayrton A. (author), Van Gurp, Jules A.M. (author), Broz, F. (author), Barakova, Emilia I. (author)
There are numerous strategies for reducing the stress and anxiety associated with pain that children experience before and after surgery. There is a potential communication barrier between hospital staff and the child which may result in inadequate pain management. Social robots may reduce the gap between the support that personnel can...
conference paper 2023
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Zhang, H. (author), Berkhout, Marco (author), Makinwa, K.A.A. (author), Fan, Q. (author)
Class-D amplifiers (CDAs) are widely used in audio applications where a high power efficiency is required. As most audio sources are digital nowadays, implementing digital-input CDAs results in higher levels of integration and lower cost. However, prior open-loop digital-input CDAs suffer from high jitter sensitivity and output-stage...
conference paper 2023
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