Searched for:
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Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), Zhang, G.Q. (author), van Zeijl, H.W. (author), Wei, J. (author)
This work describes the design, modelling and realisation of the mechanical part of a non-linear MEMS accelerometer intended for large displacement behaviour. For this, a mass/spring system was designed with an extremely low resonance frequency. In this work the mechanical behaviour was verified by measurements done using an optical setup,...
conference paper 2018
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Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), van Zeijl, H.W. (author), Wei, J. (author), Zhang, G.Q. (author), van Driel, W.D. (author)
The mechanical part of inertial sensors can be designed to have a large mechanical sensitivity, but also requires the transduction mechanism which translates this displacement. The overall system resolution in mechanical inertial sensors is dictated by the noise contribution of each stage and the magnitude of each sensitivity, see also Figure...
conference paper 2018
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Silvestri, C. (author), Riccio, M (author), Poelma, René H. (author), Jovic, A. (author), Morana, B. (author), Vollebregt, S. (author), Irace, A (author), Zhang, G.Q. (author), Sarro, P.M. (author)
The high aspect ratio and the porous nature of spatially oriented forest-like carbon nanotube (CNT) structures represent a unique opportunity to engineer a novel class of nanoscale assemblies. By combining CNTs and conformal coatings, a 3D lightweight scaffold with tailored behavior can be achieved. The effect of nanoscale coatings, aluminum...
journal article 2018
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Huang, Z.Q. (author), Poelma, René H. (author), Vollebregt, S. (author), Koelink, M.H. (author), Boschman, E. (author), Kropf, R. (author), Gallouch, M. (author), Zhang, G.Q. (author)
This article shows the fabrication process and packaging of through polymer optical vias (TPOV). The TPOV enables encapsulation and packaging of silicon photonic systems using film assisted molding (FAM) and the creation of micron-sized through polymer optical vias. The optical vias are lithographically defined in thick film photo-resist (∼ 300...
conference paper 2018
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Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), Zhang, G.Q. (author), Poelma, René H. (author)
In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the...
conference paper 2017
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Li, X. (author), Wei, L. (author), Poelma, René H. (author), Vollebregt, S. (author), Wei, J. (author), Urbach, Paul (author), Sarro, P.M. (author), Zhang, G.Q. (author)
This paper presents a tuneable binary amplitude Fresnel lens produced by wafer-level microfabrication. The Fresnel lens is fabricated by encapsulating lithographically defined vertically aligned carbon nanotube (CNT) bundles inside a polydimethyl-siloxane (PDMS) layer. The composite lens material combines the excellent optical absorption...
journal article 2016
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Silvestri, C. (author), Riccio, M. (author), Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Santagata, F. (author), Irace, A. (author), Zhang, G.Q. (author), Sarro, P.M. (author)
Thermal material properties play a fundamental role in the thermal management of microelectronic systems. The porous nature of carbon nanotube (CNT) arrays results in a very high surface area to volume ratio, which makes the material attractive for surface driven heat transfer mechanisms. Here, we report on the heat transfer performance of...
journal article 2016
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Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, G.Q. (author), van Zeijl, H.W. (author)
We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...
conference paper 2016
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Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Schlangen, H.E.J.G. (author), Van Zeijl, H.W. (author), Fan, X. (author), Zhang, G.Q. (author)
The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-lithographically defined CNT pillars that are conformally coated with amorphous silicon carbide (a-SiC) to strengthen the...
journal article 2014
document
Poelma, R.H. (author), Van Zeijl, H. (author), Zhang, G. (author)
The invention relates to vias for three dimensional (3D) stacking, packaging and heterogeneous integration of semi-conductor layers and wafers. In particular, the invention relates to a process for the manufacture of a via, to a via, to a 3D circuit and to a semiconductor device. Vias are interconnects used to vertically interconnect chips,...
patent 2014
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Wong, C.K.Y. (author), Leung, S.Y.Y. (author), Poelma, R.H. (author), Jansen, K.M.B. (author), Yuan, C.C.A. (author), Van Driel, W.D. (author), Zhang, G. (author)
Atomistic coarse grained parameters were calculated from a non-equilibrium molecular dynamics simulation of the separation of an epoxy-copper interface. The methodology to determine the interaction energy and the equilibrium distance between the interfacial materials at a minimum energy is established. The traction-displacement relations of the...
journal article 2012
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