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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...
journal article 2024
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Liu, Minne (author), Li, Wenyu (author), Chen, Wei (author), Ibrahim, Mesfin S. (author), Xiong, Jingkang (author), Zhang, Kouchi (author), Fan, Jiajie (author)
During the operation of an LED array, its thermal and optical performances are always not equal to the superposition of the individual LED's characteristics because of a significant thermal coupling effect between the arrays. Based on this, this paper proposes an electrical–photo-thermal model, with considering both junction temperature and...
journal article 2024
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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...
journal article 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...
journal article 2024
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Tu, Botao (author), Yang, Xinkui (author), Xu, S. (author), Liang, X. (author), Liu, C. (author), Jiang, Jian (author), Fan, Lulu (author), Tu, Liangliang (author)
Using solid waste to replace limestone filler in asphalt concrete can not only reduce the cost of road construction, but also improve the utilization rate of solid waste. In this study, PHC pile waste concrete (PPWC) was innovatively used to replace limestone filler in asphalt mixture and its effect on the physical and rheological properties...
journal article 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...
journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)
Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...
journal article 2023
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Li, Shizhen (author), Liu, Yang (author), Ye, H. (author), Liu, X. (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)
This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential...
journal article 2022
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Mao, Pengcheng (author), Fan, Huilin (author), Liu, Chang (author), Lan, Gongxu (author), Huang, Wei (author), Li, Zhipeng (author), Amin Hassan, H.M. (author), Zheng, Runguo (author), Wang, Zhiyuan (author), Sun, Hongyu (author), Liu, Yanguo (author)
Thanks to the low cost and earth's abundant potassium resources, potassium ion batteries (PIBs) have attracted much interest as alternative energy storage devices. However, there is still a great challenge to develop suitable anode materials for PIBs with high specific capacity, fast charge/discharge and stable ion storage. Nowadays,...
journal article 2022
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Li, Mingliang (author), Ren, S. (author), Liu, X. (author), Wu, Zhe (author), Zhang, Haopeng (author), Fan, Weiyu (author), Lin, P. (author), Xu, Jian (author)
This study aims to comprehensively investigate the rejuvenation efficiency of various self-developed compound rejuvenators on the physical, mechanical, and aging properties of aged bitumen, asphalt mortar, and mixture. The results revealed that the restoration capacity of vacuum distilled-oil rejuvenators on high-and-low temperature performance...
journal article 2022
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Fan, Jiajie (author), Jiang, Dawei (author), Zhang, Hao (author), Hu, D. (author), Liu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...
journal article 2022
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Huang, Xinxing (author), Li, Yifan (author), Tian, Zhan (author), Ye, Qinghua (author), Ke, Q. (author), Fan, Dongli (author), Mao, Ganquan (author), Chen, Aifang (author), Liu, Junguo (author)
Efficient and accurate streamflow predictions are important for urban water management. Data-driven models, especially neural network (NN) models can predict streamflow fast, while the results are uncertain in some complex river systems. Physically based models can reveal the underlying physics, but it is relatively slow and computationally...
journal article 2021
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Ren, S. (author), Liu, X. (author), Lin, P. (author), Wang, H. (author), Fan, W. (author), Erkens, S. (author)
The chemo-rheological properties of crumb rubber modified bitumen are always unstable due to the mutable and uncontrollable swelling-degradation degree of crumb rubber in bitumen matrix. The study aimed at exploring the continuous swelling and degradation behaviors of crumb rubber modified bitumen (CRMB) considering the influence of rubber size...
journal article 2021
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Hou, F. (author), Zhang, Hengyun (author), Huang, Dezhu (author), Fan, J. (author), Liu, Fengman (author), Lin, Tingyu (author), Cao, Liqiang (author), Fan, Xuejun (author), Ferreira, Braham (author), Zhang, Kouchi (author)
In this article, a microchannel thermal management system (MTMS) with the two-phase flow using the refrigerant R1234yf with low global warming potential is presented. The thermal test vehicles (TTVs) were made of either single or multiple thermal test chips embedded in the substrates, which were then attached to the MTMS. The system included...
journal article 2020
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Fan, B. (author), Zhang, K. (author), Liu, Q. (author), Eelkema, R. (author)
Introduction of dynamic thiol-alkynone double addition cross-links in a polymer network enable the formation of a self-healing injectable polymer hydrogel. A four-arm polyethylene glycol (PEG) tetra-thiol star polymer is cross-linked by a small molecule alkynone via the thiol-alkynone double adduct to generate a hydrogel network under ambient...
journal article 2020
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Ren, S. (author), Liu, X. (author), Li, Mingliang (author), Fan, Weiyu (author), Xu, Jian (author), Erkens, S. (author)
It is well known that crumb rubber (CR) and styrene–butadienestyrene (SBS) composite modified asphalt has better rheological and engineering performance. However, it always presents very poor compatibility and storage stability. Meanwhile, Trans-polyoctenamer (TOR) can effectively improve the compatibility and thermal stability of rubber...
journal article 2020
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Liu, Y. (author), van der Meer, F.P. (author), Sluys, Lambertus J. (author), Fan, J. T. (author)
With a classical notched configuration, the damage process in the transverse plane of fiber-reinforced polymer composites are studied by a direct numerical simulation model (DNS). However, to avoid high computational costs the region in which the fiber/matrix microstructure is explicitly modeled must remain small. Therefore, away from the...
journal article 2020
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Ren, S. (author), Liu, X. (author), Wang, H. (author), Fan, Weiyu (author), Erkens, S. (author)
Recycling technology is widely used in the asphalt road construction due to its environmental and economic effects. Many efforts have focused on the performance restoration of aged base asphalt by adding light oil, but the possibility of recycling the aged asphalt using low-viscosity asphalt and polymers has been few explored. Therefore, the...
journal article 2020
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Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)
The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation hardness were first investigated. Then yield stress of nanosilver sintered joint was studied in...
journal article 2019
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Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Jiajie (author), Placette, Mark D. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...
journal article 2019
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