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Li, Shengli (author), Liu, Y. (author), Zhang, H. (author), Cai, Hongming (author), Sun, Fenglian (author), Zhang, Kouchi (author)
In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu<sub>6</sub>Sn<sub>5</sub...
journal article 2018
document
Chen, G. (author), Liu, Y. (author), Lodewijks, G. (author), Schott, D.L. (author)
The handling of iron ore bulk solids maintains an increasing trend due to economic development. Because iron ore particles have hard composites and irregular shapes, the bulk solids handling equipment surface can suffer from severe sliding wear. Prediction of equipment surface wear volume is beneficial to the efficient maintenance of worn areas....
journal article 2017