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Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)
The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation hardness were first investigated. Then yield stress of nanosilver sintered joint was studied in...
journal article 2019
document
Zhang, H. (author), Liu, Yang (author), Wang, Lingen (author), Fan, Jiajie (author), Fan, Xuejun (author), Sun, Fenglian (author), Zhang, G.Q. (author)
High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There...
journal article 2018