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Yazdan Mehr, M. (author), Hajipour, Pejman (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Cooremans, Thierry (author), De Buyl, Francois (author), Zhang, Kouchi (author)Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing...conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...conference paper 2023
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Ji, X. (author), van Zeijl, H.W. (author), Jiao, Weiping (author), He, S. (author), Du, L. (author), Zhang, Kouchi (author)The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to...conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)This paper reports the design and fabrication of a 4H-SiC CMOS readout circuit enabling monolithic integration of silicon carbide (SiC) sensors and circuits. Compared to conventional Si electronics, 4H-SiC integrated circuits can sustain operation in harsh conditions such as higher temperatures and radiation levels. The proposed amplifier...conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely...conference paper 2023
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Sun, B. (author), Mo, J. (author), Zhang, Hemin (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The...conference paper 2023
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Ji, X. (author), van Zeijl, H.W. (author), Romijn, J. (author), van Ginkel, H.J. (author), Liu, X. (author), Zhang, Kouchi (author)The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...conference paper 2022
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Ji, X. (author), van Ginkel, H.J. (author), Hu, D. (author), Schmidt-Ott, A. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...conference paper 2022
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...conference paper 2022
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Romijn, J. (author), Vollebregt, S. (author), May, Alexander (author), Erlbacher, Tobias (author), van Zeijl, H.W. (author), Leijtens, J.A.P. (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)In this paper, we present a quadrant sun position sensor microsystem device in a silicon carbide technology that operates in a field-of-view of ±33° and reaches a mean error of 1.9° in this range. This will allow, for the first time, an inherently visible blind sun position sensor in a CMOS compatible technology. Opto-electronic integration of...conference paper 2022
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Romijn, J. (author), Middelburg, L.M. (author), Vollebregt, S. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)Accurately sensing the temperature in silicon carbide (power) devices is of great importance to their reliable operation. Here, temperature sensors by resistive and CMOS structures are fabricated and characterized in an open silicon carbide CMOS technology. Over a range of 25-200°C, doped design layers have negative temperature coefficients of...conference paper 2021
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Romijn, J. (author), Vollebregt, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Leijtens, Johan (author), Sarro, Pasqualina M (author)In this paper we present a sun position sensor platform with a scalable approach for the 3D integration of the sensor optics. This would facilitate the sun position sensor miniaturization, reduces fabrication cost and mitigates the need for sensor calibration. The sun position sensor platform is implemented in a seven mask BICMOS technology with...conference paper 2021
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)This paper focuses on the design and fabrication of a new programmable thermal test chip as a flexible and cost-effective solution for simplification of characterization/prototyping of new packages. The cell-based design format makes the chip fit into any modular array configuration. One unit cell is as small as 4x4 mm2, including 6 individually...conference paper 2021
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Liu, Pan (author), Li, J. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of...conference paper 2020
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Zhang, B. (author), Wei, J. (author), Bottger, A.J. (author), van Zeijl, H.W. (author), Sarro, Pasqualina M (author), Zhang, Kouchi (author)We report the design, fabrication and experimental investigation of a MEMS micro-hotplate (MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste (nanoCu paste) sintering process. The device and its system are designed to have a 60 ms minimum time interval, uniform temperature distribution and variant gas...conference paper 2019
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Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), van Zeijl, H.W. (author), Wei, J. (author), Zhang, Kouchi (author), van Driel, W.D. (author)The mechanical part of inertial sensors can be designed to have a large mechanical sensitivity, but also requires the transduction mechanism which translates this displacement. The overall system resolution in mechanical inertial sensors is dictated by the noise contribution of each stage and the magnitude of each sensitivity, see also Figure...conference paper 2018
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Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author), Wei, J. (author)This work describes the design, modelling and realisation of the mechanical part of a non-linear MEMS accelerometer intended for large displacement behaviour. For this, a mass/spring system was designed with an extremely low resonance frequency. In this work the mechanical behaviour was verified by measurements done using an optical setup,...conference paper 2018
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Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the...conference paper 2017
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Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author)We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...conference paper 2016