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Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Yang, D.G. (author), Zhang, G.Q. (author), Ernst, L.J. (author), van 't Hof, C. (author), Caers, J.F.J.M. (author), Bressers, H.J.L. (author), Janssen, J.H.J. (author)

journal article 2003