Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

Naturally effective inhibition of microbial corrosion on carbon steel by beneficial biofilm in the South China Sea

In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks

Revealing The Degradation Mechanism of (Sr,Ca)AlSiN₃:Eu²⁺ Phosphor Aged Under Thermal-Moisture-Sulfur Conditions: A Combined Experimental and Ab Initio Study

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Warpage deformation analysis of AMB ceramic substrates in power modules

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

3.1 A 120.9dB DR, -111.2dB THD+N Digital-Input Capacitively-Coupled Chopper Class-D Audio Amplifier

A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

Assessment of Vigilance Level during Work: Fitting a Hidden Markov Model to Heart Rate Variability

A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

A Class-D Piezoelectric Speaker Driver Using A Quadrature Feedback Chopping Scheme achieving 29dB Large-Signal THD+N Improvement