Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Degradation of silicone-based sealing materials used in microelectronics

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

Digital Twin-Based Hybrid PHM Framework for Monitoring Package-Level Degradation

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device

Silicon carbide-on-insulator thermal-piezoresistive resonator for harsh environment application

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

In-situ reliability monitoring of power packages using a Thermal Test Chip

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Outlook: From Physics of Failure to Physics of Degradation

Degradation and Failures of Polymers Used in Light-Emitting Diodes

Erratum: The inactivation mechanism of chemical disinfection against SARS-CoV-2: The MD and DFT perspectives(RSC Advances (2020) 10 (40480–40488) DOI: 10.1039/D0RA06730J)

Facile synthesis of ag nanowire/tio2 and ag nanowire/tio2/go nanocomposites for photocatalytic degradation of rhodamine b

System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method

Ultraviolet Sensing in WBG: SiC

Towards multi-functional SiO₂ @YAG: Ce core–shell optical nanoparticles for solid state lighting applications