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Du, L. (author), Zhao, Xiujuan (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...conference paper 2023
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Du, L. (author), Zhao, Xiujuan (author), Watte, Piet (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...conference paper 2022
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Zhang, S. (author)Steel components can exhibit premature and low-ductility creep fracture, when exposed to high temperatures for long times. The failure arises from the formation, growth and coalescence of ultra-fine cracks and cavities. Self healing of damage is a promising new approach to enhance the lifetime of the steel components, in particular for...doctoral thesis 2015
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Langelaan, G. (author), Zhang, S. (author), Brück, E. (author), Van der Zwaag, S. (author), Van Dijk, N.H. (author)Abstract only.conference paper 2013
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- Zhang, L. (author) doctoral thesis 1995