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Sun, Yubo (author), Mohan, Manu K. (author), Tao, Yaxin (author), Zhang, Yi (author), Van Tittelboom, Kim (author), Ye, G. (author), De Schutter, Geert (author)To properly control the reaction kinetics and fresh properties evolution in conventional alkali-activated materials (AAMs), a conceptual design of two-stream AAMs has been proposed in this study. This is achieved by dividing the solid and liquid components in AAMs, including blast furnace slag (BFS) and electric arc furnace slag (EFS)...journal article 2024
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Sun, Renjuan (author), Bu, Linglai (author), Zhang, Hongzhi (author), Guan, Yanhua (author), Ma, Chuanyi (author), Ge, Zhi (author), Šavija, B. (author)White mud is a solid waste from the papermaking industry, composed mainly of CaCO<sub>3</sub> and residual alkali metal ions (such as Na+, Mg<sup>2+</sup>). In the current study, the feasibility of using white mud as partial replacement of slag in alkali activated materials is explored. The fluidity, setting time, autogenous shrinkage,...journal article 2023
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Sun, Yubo (author), Zhang, Shizhe (author), Rahul, A. V. (author), Tao, Yaxin (author), Van Bockstaele, Filip (author), Dewettinck, Koen (author), Ye, G. (author), De Schutter, Geert (author)This study aims to interpret the early-stage rheology of alkali-activated slag (AAS) paste from microstructure perspectives. The microstructures visualized by cryogenic scanning electron microscopy (cryo-SEM) revealed the essential distinction between hydroxide and silicate-activated slag pastes. The hydroxide-based mixture showed typical...journal article 2022
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Sun, Renjuan (author), Lu, Wei (author), Tawfek, Abdullah M. (author), Guan, Yanhua (author), Hu, Xinlei (author), Zhang, Hongzhi (author), Ling, Yifeng (author), Šavija, B. (author)The resistance of cracked ECC against chloride ingress is mainly governed by the accumulated crack width of all the cracks rather than the maximum width of multiple cracks. However, most studies focus on the influence of a single fine crackjournal article 2022
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Li, Shengli (author), Liu, Y. (author), Zhang, H. (author), Cai, Hongming (author), Sun, Fenglian (author), Zhang, Kouchi (author)In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu<sub>6</sub>Sn<sub>5</sub...journal article 2018