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Grachev, S.Y. (author), Tichelaar, F.D. (author), Janssen, G.C.A.M. (author)
We studied the tensile stress and grain-width evolution in sputter-deposited Cr films with thickness from 20?nm to 2.7??m. Films were deposited in an industrial Hauzer 750 physical vapor deposition machine at 50–80?°C. The films exhibited a columnar microstructure. A power law behavior of the tensile stress as well as of the average grain width...
journal article 2005
document
Janssen, G.C.A.M. (author), Tichelaar, F.D. (author), Visser, C.C.G. (author)
Stress in hard films is the net sum of tensile stress generated at the grain boundaries, compressive stress due to ion peening, and thermal stress due to the difference in thermal expansion of the coating and substrate. The tensile part due to grain boundaries is thickness dependent. The other two contributions are not thickness dependent....
journal article 2006
document
Pujada, B.R. (author), Tichelaar, F.D. (author), Janssen, G.C.A.M. (author)
Tungsten carbide-diamond like carbon (WC-DLC) multilayer coatings have been prepared by sputter deposition from a tungsten-carbide target and periodic switching on and off of the reactive acetylene gas flow. The stress in the resulting WC-DLC multilayers has been studied by substrate curvature. Periodicity and microstructure have been studied by...
journal article 2007
document
Pujada, B.R. (author), Tichelaar, F.D. (author), Arnoldbik, W.M. (author), Sloof, W.G. (author), Janssen, G.C.A.M. (author)
Growth stress in tungsten carbide-diamond-like carbon coatings, sputter deposited in a reactive argon/acetylene plasma, has been studied as a function of the acetylene partial pressure. Stress and microstructure have been investigated by wafer curvature and transmission electron microscopy (TEM) whereas composition and energy distribution...
journal article 2009
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